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Thermal Microcracking due to CTE Misalignment
Storyboard

During post-curing cooling, the thermal expansion coefficient mismatch between fiber and matrix (E5) generates microcracks in the matrix, especially in transverse layers of multidirectional laminates.

>Model

ID:('ky', 1652)

Model Structure
Description

ID:(0, 1652)

gphysics.net - Dr. Willy H. Gerber
Palos Verdes, Costa de Corral, Región de los Rios, Chile